Elmos Semiconductor
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Company type | Public company |
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| Headquarters | , |
Area served | automotive |
| Products | Semiconductors, microstructures |
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| Subsidiaries | Silicon Microstructures |
| Website | http://www.elmos.de/ |
| Footnotes / references Garnter ranked #2 Automotive ASIC Supplier | |
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Elmos Semiconductor SE is a German manufacturer of semiconductor products headquartered in Dortmund, Germany. Elmos supplies automotive application-specific integrated circuits (ASICs).
History
- 1984 - Founded in Dortmund, Germany
- 1985 - 32 employees, 0.4 M DM turnover, Installation of 4" Wafer Fab in Dortmund
- 1994 - DIN ISO 9001 certificate
- 1998 - 460 employees, 140 M DM turnover. Complete supply from new 6" line
- 1999 - IPO to new market, Frankfurt
- 2001 - 630 employees, 107 million Euro turnover Acquisition of Eurasem (Packaging, NL) and SMI (MEMS, USA)
- 2002 - TS16949
- 2005 - Opened 8" wafer fab in Duisburg as second production line
- 2020 - Conversion of legal form into a Societas Europaea
- 2022 - media reports about possible Chinese takeover[1] which the German government eventually vetoed[2]
Silicon Microstructures acquisition and sale to TE Connectivity
Silicon Microstructures, Inc.(SMI) was founded in 1991 as a commercial source of high-performance silicon pressure sensors, including Microelectromechanical systems sensors, and accelerometers. Its first product was a silicon sensor for very low-pressure usage.
Elmos Semiconductor acquired SMI in March 2001 from OSI Systems.[3] SMI began production on higher performance, system level sensors and microstructures, wireless, RF and bus addressable microstructures.
In August 2002, SMI acquired the IC Sensors' wafer fabrication operations and wafer R&D group and relocated to Milpitas, California. The following year, Silicon Microstructures undertook a significant and complete wafer fabrication upgrade to expand the facility for full 6" wafer handling. This facility processed primarily 6 inch wafers and has advanced technical capabilities including deep reactive ion etching (DRIE) and plasma enhanced fusion bonding.[<span title="Script error: No such module "decodeEncode".">clarification needed]
In 2019, Elmos announced the sale of Silicon Microstructures to TE Connectivity, and the subsequent closure of Elmos Group’s micromechanics division.[4]
References
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- ^ Page Module:Citation/CS1/styles.css has no content."Germany likely to block Chinese takeover of Elmos' chip production". Reuters. 2022-11-07. Retrieved 2023-05-09.
- ^ Page Module:Citation/CS1/styles.css has no content.Rinke, Andreas; Murray, Miranda (10 November 2022). "Germany blocks Chinese stake in two chipmakers over security concerns". Reuters.
- ^ Page Module:Citation/CS1/styles.css has no content."OSI Systems sells subsidiary SMI to Elmos Semiconductor" (Press release). March 13, 2001. Archived from the original on 20 September 2016. Retrieved 2 September 2016.
- ^ Page Module:Citation/CS1/styles.css has no content."Elmos to sell Silicon Microstructures to TE Connectivity" (Press release). September 23, 2019. Retrieved 17 December 2024.
External links
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