Zen 2

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AMD Zen 2
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General information
Launched7 July 2019; 7 years ago (7 July 2019)[1]
Designed byAMD
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CPUID codeFamily 17h
Physical specifications
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  • 5.89 billion (1× CCD) or
    9.69 billion (2× CCD)
    (3.8 billion per 7 nm 8-core "CCD" & 2.09 billion for the 12 nm "I/O die")[2]
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Cache
L1 cache64 KB per core:
  • 32 KB instructions
  • 32 KB data
L2 cache512 KB per core
L3 cache16 MB per Page Template:Tooltip/styles.css has no content.Template:Encodefirst (APU: 8 MB)
Architecture and classification
Technology nodeTSMC N7[3][4]
TSMC N6[5]
MicroarchitectureZen
Instruction setAMD64 (x86-64)
Products, models, variants
Product code namesPage Template:Plainlist/styles.css has no content.
  • Matisse (desktop)
  • Rome (server)[4]
  • Castle Peak (HEDT/workstation)
  • Renoir (Desktop APU, mobile and embedded)
  • Mendocino (mobile and embedded refresh)
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History
PredecessorTemplate:Pluralize from textZen+
SuccessorTemplate:Pluralize from textZen 3
Support status
Supported

Zen 2 is a computer processor microarchitecture by AMD. It is the successor of AMD's Zen and Zen+ microarchitectures, and is fabricated on the 7 nm MOSFET node from TSMC. The microarchitecture powers the third generation of Ryzen processors, known as Ryzen 3000 for the mainstream desktop chips (codename "Matisse"), Ryzen 4000U/H (codename "Renoir") and Ryzen 5000U (codename "Lucienne") for mobile applications, as Threadripper 3000 for high-end desktop systems,[6][7] and as Ryzen 4000G for accelerated processing units (APUs). The Ryzen 3000 series CPUs were released on 7 July 2019,[8][9] while the Zen 2-based Epyc server CPUs (codename "Rome") were released on 7 August 2019.[10] An additional chip, the Ryzen 9 3950X, was released in November 2019.[8]

At CES 2019, AMD showed a Ryzen third-generation engineering sample that contained one chiplet with eight cores and 16 threads.[6] AMD CEO Lisa Su also said to expect more than eight cores in the final lineup.[11] At Computex 2019, AMD revealed that the Zen 2 "Matisse" processors would feature up to 12 cores, and a few weeks later a 16 core processor was also revealed at E3 2019, being the aforementioned Ryzen 9 3950X.[12][13]

Zen 2 includes hardware mitigations to the Spectre security vulnerability.[14] Zen 2-based EPYC server CPUs use a design in which multiple CPU dies (up to eight in total) manufactured on a 7 nm process ("chiplets") are combined with a 14nm I/O die (as opposed to the 12nm IOD on Matisse variants) on each multi-chip module (MCM) package. Using this, up to 64 physical cores and 128 total compute threads (with simultaneous multithreading) are supported per socket. This architecture is nearly identical to the layout of the "pro-consumer" flagship processor Threadripper 3990X.[15] Zen 2 delivers about 15% more instructions per clock than Zen and Zen+,[16][17] the 14- and 12-nm microarchitectures utilized on first and second generation Ryzen, respectively.

The Steam Deck,[18][19] PlayStation 5, Xbox Series X and Series S all use chips based on the Zen 2 microarchitecture, with proprietary tweaks and different configurations in each system's implementation than AMD sells in its own commercially available APUs.[20][21]

Design

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File:Ryzen 5 3600 Infrared.jpg
File:AMD Epyc 7702 delidded.jpg
Two delidded Zen 2 processors designed with the multi-chip module approach. The Ryzen 5 3600 CPU on the left/top (used for mainstream Ryzen CPUs) uses a smaller, less capable I/O die and one CCD (the space for an additional CCD is used on the Ryzen 9), while the Epyc 7702 on the right/bottom (used for high-end desktop, HEDT, Ryzen Threadripper and server Epyc CPUs) uses a larger, more capable I/O die and up to eight CCDs.

Zen 2 is a significant departure from the physical design paradigm of AMD's previous Zen architectures, Zen and Zen+. Zen 2 moves to a multi-chip module design where the I/O components of the CPU are laid out on its own die which is separate from the dies containing processor cores, which are also called chiplets in this context. This separation has benefits in scalability and manufacturability. As physical interfaces don't scale very well with shrinks in process technology, their separation into a different die allows these components to be manufactured using a larger, more mature process node than the CPU dies. The CPU dies (referred to by AMD as core complex dies or CCDs), now more compact due to the move of I/O components onto another die, can be manufactured using a smaller process with fewer manufacturing defects than a larger die would exhibit (since the chances of a die having a defect increases with device (die) size) while also allowing for more dies per wafer. In addition, the central I/O die can service multiple chiplets, making it easier to construct processors with a large number of cores.[15][22][23]

File:Zen2 Microarchitektur.svg
Simplified illustration of the Zen 2 microarchitecture

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File:AMD@7nm(12nmIOD)@Zen2@Rome@EPYC 7702 ES@2S1404E2VJUG5 BB ES DSCx16 CCD polysilicon@5xLED.jpg
File:AMD@7nm(12nmIOD)@Zen2@Rome@EPYC 7702 ES@2S1404E2VJUG5 BB ES DSCx13 IOD polysilicon@5x.jpg
File:AMD@7nm(12nmIOD)@Zen2@Matisse@Ryzen 5 3600@100-000000031 BF 1923SUT 9HM6935R90062 DSCx8 IOD polysilicon@5x.jpg
On the left (top on mobile): Die shot of a Zen 2 Core Complex Die. On the middle: Die shot of a Zen 2 EPYC/Threadripper I/O die, On the right (bottom): I/O die of a Zen 2 mainstream Ryzen I/O die.

With Zen 2, each CPU chiplet houses 8 CPU cores, arranged in 2 core complexes (CCXs), each of 4 CPU cores. These chiplets are manufactured using TSMC's 7 nanometer MOSFET node and are about 74 to 80 mm2 in size.[22] The chiplet has about 3.8 billion transistors, while the 12 nm I/O die (IOD) is ~125 mm2 and has 2.09 billion transistors.[24] The amount of L3 cache has been doubled to 32 MB, with each CCX in the chiplet now having access to 16 MB of L3 compared to the 8 MB of Zen and Zen+.[25] AVX2 performance is greatly improved by an increase in execution unit width from 128-bit to 256-bit.[26] There are multiple variants of the I/O die: one manufactured on GlobalFoundries 14 nanometer process, and another manufactured using the same company's 12 nanometer process. The 14 nanometer dies have more features and are used for the EPYC Rome processors, whereas the 12 nm versions are used for consumer processors.[22] Both processes have similar feature sizes, so their transistor density is also similar.[27]

AMD's Zen 2 architecture can deliver higher performance at a lower power consumption than Intel's Cascade Lake architecture, with an example being the AMD Ryzen Threadripper 3970X running with a TDP of 140 W in ECO mode delivering higher performance than the Intel Core i9-10980XE running with a TDP of 165 W.[28]

New features

  • Some new instruction set extensions: WBNOINVD, CLWB, RDPID, RDPRU, MCOMMIT. Each instruction uses its own CPUID bit.[29][30]
  • Hardware mitigations against the Spectre V4 speculative store bypass vulnerability.[31]
  • Zero-latency memory mirroring optimization (undocumented).[32]
  • Doubled width of the execution units and load store units (from 128-bit to 256-bit) in the floating point coprocessor and significant further throughput enhancements in the multiplication execution unit. This allows the FPU to perform single-cycle AVX2 calculations.[33]
  • Introduced CPPC power management.[34]

Feature tables

CPUs

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APUs

APU features table

Products

On 26 May 2019, AMD announced six Zen 2-based desktop Ryzen processors (codenamed "Matisse"). These included 6-core and 8-core variants in the Ryzen 5 and Ryzen 7 product lines, as well as a new Ryzen 9 line that includes the company's first 12-core and 16-core mainstream desktop processors.[35]

The Matisse I/O die is also used as the X570 chipset.

AMD's second generation of Epyc processors, codenamed "Rome", feature up to 64 cores, and were launched on 7 August 2019.[10]

Desktop CPUs

Matisse (3000 series)

Template:AMD Ryzen 3000 Series

Castle Peak (3000 series)

Template:AMD Ryzen Threadripper 3000 series

Renoir (4000 series)

Based on the Ryzen 4000G series APUs but with the integrated graphics disabled. Template:AMD Ryzen 4000 series

Desktop APUs

Initially only provided to OEM; later, AMD released retail Zen 2 desktop APUs in April 2022.[36] Template:AMD Ryzen 4000G series

Mobile APUs

Renoir (4000 series)

Template:AMD Ryzen Mobile 4000 series

Lucienne (5000 series)

Template:AMD Ryzen Mobile 5000 Zen 2 based series

Ultra-mobile APUs

In 2022, AMD announced the Mendocino ultra-mobile APUs.[37]

Template:AMD Ryzen Mobile 7020 series

Embedded APUs

Template:AMD Ryzen Embedded V2000 Series

Server CPUs

Template:AMD Epyc 7002 series

Video game consoles and other embedded

See also

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Wikimedia Commons has media related to Zen 2 microarchitecture.Template:Preview warning

References

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  1. ^ Page Module:Citation/CS1/styles.css has no content."AMD Unleashes Ultimate PC Gaming Platform with Worldwide Availability of AMD Radeon RX 5700 Series Graphics Cards and AMD Ryzen 3000 Series Desktop Processors". AMD (Press release). Santa Clara, California. 7 July 2019. Retrieved 7 November 2020.
  2. ^ Page Module:Citation/CS1/styles.css has no content."Zen 2 - Microarchitectures - AMD". WikiChip. Retrieved 14 June 2020.
  3. ^ Page Module:Citation/CS1/styles.css has no content.Larabel, Michael (16 May 2017). "AMD Talks Up Vega Frontier Edition, Epyc, Zen 2, ThreadRipper". Phoronix. Retrieved 16 May 2017.
  4. ^ a b Page Module:Citation/CS1/styles.css has no content.Cutress, Ian (20 June 2017). "AMD EPYC Launch Event Live Blog". AnandTech. Archived from the original on 20 June 2017. Retrieved 21 June 2017.
  5. ^ Page Module:Citation/CS1/styles.css has no content.Boshor, Gavin (20 September 2022). "AMD Launches Mendocino APUs: Zen 2-based Ryzen and Athlon 7020 Series with RDNA 2 Graphics". AnandTech. Archived from the original on 20 September 2022. Retrieved 26 September 2022.
  6. ^ a b Page Module:Citation/CS1/styles.css has no content.Cutress, Ian (9 January 2019). "AMD Ryzen third Gen 'Matisse' Coming Mid 2019: Eight Core Zen 2 with PCIe 4.0 on Desktop". AnandTech. Archived from the original on 9 January 2019. Retrieved 15 January 2019.
  7. ^ Page Module:Citation/CS1/styles.css has no content.online, heise (27 May 2019). "AMD Ryzen 3000: 12-Kernprozessoren für den Mainstream". c't Magazin.
  8. ^ a b Page Module:Citation/CS1/styles.css has no content.Leather, Antony (7 July 2019). "AMD Ryzen 9 3900X and Ryzen 7 3700X Review: Old Ryzen Owners Look Away Now". Forbes. Retrieved 13 April 2023.
  9. ^ Page Module:Citation/CS1/styles.css has no content.Ridley, Jacob (27 May 2019). "AMD Ryzen 3000 CPUs launching July 7 with up to 12 cores". PCGamesN. Retrieved 28 May 2019.
  10. ^ a b Page Module:Citation/CS1/styles.css has no content."2nd Gen AMD EPYC Processors Set New Standard for the Modern Datacenter with Record-Breaking Performance and Significant TCO Savings". AMD. 7 August 2019. Retrieved 8 August 2019.
  11. ^ Page Module:Citation/CS1/styles.css has no content.Hachman, Mark (9 January 2019). "AMD's CEO Lisa Su confirms ray tracing GPU development, hints at more 3rd-gen Ryzen cores". PCWorld. Retrieved 15 January 2019.
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  17. ^ Page Module:Citation/CS1/styles.css has no content.Walton, Steven (16 November 2020). "AMD Ryzen 5000 IPC Performance Tested". TechSpot. Retrieved 18 April 2021.
  18. ^ Page Module:Citation/CS1/styles.css has no content.Hollister, Sean (13 November 2021). "Steam Deck: Five big things we learned from Valve's developer summit". The Verge. Retrieved 13 April 2023.
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  23. ^ Page Module:Citation/CS1/styles.css has no content.De Gelas, Johan (7 August 2019). "AMD Rome Second Generation EPYC Review: 2x 64-core Benchmarked". AnandTech. Archived from the original on 29 September 2019. Retrieved 29 September 2019.
  24. ^ Page Module:Citation/CS1/styles.css has no content.November 2019, Paul Alcorn 21 (21 November 2019). "AMD Ryzen 9 3900X and Ryzen 7 3700X Review: Zen 2 and 7nm Unleashed". Tom's Hardware.{{cite web}}: CS1 maint: numeric names: authors list (link)
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  34. ^ https://www.phoronix.com/news/AMD-New-CPUFreq-CPPC
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